This ultrafast rectifier in the dual flag SO−8 flat lead package offers

designers a unique degree of versatility and design freedom. The two

devices are electrically independent and can be used separately, as

common cathode, as common anode or in series as a function of board

level layout. The exposed pad design provides low thermal resistance.

The clip attach design creates a package with very efficient die size to

board area ratio. While thermal performance is nearly the same as the

DPAK package height and board footprint are less than half.

Features

• New Package Provides Capability of Inspection and Probe After

Board Mounting

• Low Forward Voltage Drop

• 175°C Operating Junction Temperature

• NRV Prefix for Automotive and Other Applications Requiring

Unique Site and Control Change Requirements; AEC−Q101

Qualified and PPAP Capable

• These are Pb−Free and Halide−Free Devices

Mechanical Characteristics:

• Case: Epoxy, Molded

• Epoxy Meets Flammability Rating UL 94−0 @ 0.125 in.

• Lead Finish: 100 Matte Sn (Tin)

• Lead and Mounting Surface Temperature for Soldering Purposes:

260°C Max. for 10 Seconds

• Device Meets MSL 1 Requirements

Applications

• Excellent Alternative to DPAK in Space−Constrained Automotive Applications

• Output Rectification in Switching Power Supplies

• Freewheeling Diode used with Inductive Loads