Description

The NCP303152 integrates a MOSFET driver, high−side MOSFET

and low−side MOSFET into a single package.

The driver and MOSFETs have been optimized for high−current

DC−DC buck power conversion applications. The NCP303152

integrated solution greatly reduces package parasitics and board space

compared to a discrete component solution.

Features

• Capable of Average Currents up to 50 A

• Capable of 80 A (10 ms) Peak Current

• 80 A Packaged−Level UIS Tested to Improve Robustness

• 30 V / 30 V Breakdown Voltage MOSFETs for Higher Long Term

Reliability

• High−Performance, Universal Footprint, Copper−Clip 5 mm x 6 mm

PQFN Package

• Capable of Switching at Frequencies up to 1 MHz

• Compatible with 3.3 V or 5 V PWM Input

• Responds Properly to 3−level PWM Inputs

• Precise Current Monitoring

• Integrated Temperature Monitoring (TMON)

• Option for Zero Cross Detection with 3−level PWM

• Internal Bootstrap Diode

• Catastrophic Fault Detection

♦ Thermal Flag (OTP) for Over−Temperature Condition

♦ Over−Current Protection FAULT (OCP)

♦ Under−Voltage Lockout (UVLO) on VCC and PVCC

♦ Under−Voltage Protection FAULT on Boot−SW

• These Devices are Pb−Free and are RoHS Compliant

Applications

• Desktop & Notebook Microprocessors

• Graphic Cards

• Routers and Switches