位置:MBRB30H60CT-1G_V01 > MBRB30H60CT-1G_V01详情
MBRB30H60CT-1G_V01中文资料
MBRB30H60CT-1G_V01数据手册规格书PDF详情
Features and Benefits
• Low Forward Voltage
• Low Power Loss/High Efficiency
• High Surge Capacity
• 175°C Operating Junction Temperature
• 30 A Total (15 A Per Diode Leg)
• Guard−Ring for Stress Protection
• AEC−Q101 Qualified and PPAP Capable
• NRVBB Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements
• These are Pb−Free and Halide Free Devices*
Applications
• Power Supply − Output Rectification
• Power Management
• Instrumentation
Mechanical Characteristics:
• Case: Epoxy, Molded
• Epoxy Meets UL 94 V−0 @ 0.125 in
• Weight (Approximately): 1.5 Grams (I2PAK)
Weight (Approximately): 1.7 Grams (D2PAK)
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
• Lead Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
onsemi |
25+ |
I2PAK(TO-262) |
12369 |
样件支持,可原厂排单订货! |
|||
onsemi |
25+ |
I2PAK(TO-262) |
12421 |
正规渠道,免费送样。支持账期,BOM一站式配齐 |
|||
onsemi |
25+ |
TO-262-3 长引线 I?Pak TO-26 |
9350 |
独立分销商 公司只做原装 诚心经营 免费试样正品保证 |
|||
ON/安森美 |
25+ |
电联咨询 |
7800 |
公司现货,提供拆样技术支持 |
|||
三年内 |
1983 |
只做原装正品 |
|||||
Vishay Semiconductor Diodes Di |
22+ |
TO263AB |
9000 |
原厂渠道,现货配单 |
|||
VISHAY |
17+ |
TO-263 |
6200 |
100%原装正品现货 |
|||
GENERALSEMICONDUCTORVISHAY |
24+ |
NA |
1100 |
原装现货,专业配单专家 |
|||
VISHAY |
25+ |
TO-263 |
1675 |
就找我吧!--邀您体验愉快问购元件! |
|||
VISHAY/威世 |
23+ |
TO-263 |
50000 |
全新原装正品现货,支持订货 |
MBRB30H60CT-1G_V01 资料下载更多...
MBRB30H60CT-1G_V01 芯片相关型号
- 857-024-458-201
- 857-024-458-202
- 857-024-458-203
- 857-024-458-207
- AMT123S-2000-1000
- AMT123S-2000-2000
- AMT123S-2000-3000
- AMT123S-2000-3175
- AMT123S-2000-4000
- AMT123S-2000-4760
- AMT123S-2000-5000
- AMT123S-2000-6000
- AMT123S-2000-6350
- ATS-03C-50-C3-R0
- ATS-20A-80-C3-R0
- BACC63CT15G19SA
- BACC63CT15G19SAH
- CTBP92HE/4
- FLCS-156-P
- J96068822N75221
- J96068822N76121
- KAC-ADZ-H/Q
- MBRB30H60CT-1G
- MBRB30H60CTT4G
- TF30P02
ONSEMI相关芯片制造商
Datasheet数据表PDF页码索引
- P1
- P2
- P3
- P4
- P5
- P6
- P7
- P8
- P9
- P10
- P11
- P12
- P13
- P14
- P15
- P16
- P17
- P18
- P19
- P20
- P21
- P22
- P23
- P24
- P25
- P26
- P27
- P28
- P29
- P30
- P31
- P32
- P33
- P34
- P35
- P36
- P37
- P38
- P39
- P40
- P41
- P42
- P43
- P44
- P45
- P46
- P47
- P48
- P49
- P50
- P51
- P52
- P53
- P54
- P55
- P56
- P57
- P58
- P59
- P60
- P61
- P62
- P63
- P64
- P65
- P66
- P67
- P68
- P69
- P70
- P71
- P72
- P73
- P74
- P75
- P76
- P77
- P78
- P79
- P80
- P81
- P82
- P83
- P84
- P85
- P86
- P87
- P88
- P89
- P90
- P91
- P92
- P93
- P94
- P95
- P96
- P97
- P98
- P99
- P100
- P101
- P102
- P103
- P104
- P105
- P106
- P107
- P108
