位置:MBRB2060CTG_V01 > MBRB2060CTG_V01详情
MBRB2060CTG_V01中文资料
MBRB2060CTG_V01数据手册规格书PDF详情
These state-of-the-art devices employ the use of the Schottky Barrier
principle with a platinum barrier metal.
Features
• Package Designed for Power Surface Mount Applications (D2PAK)
• Center-Tap Configuration (D2PAK)
• Guardring for Stress Protection
• Low Forward Voltage
• 175°C Operating Junction Temperature
• Epoxy Meets UL 94 V−0 @ 0.125 in
• Short Heat Sink Tab Manufactured − Not Sheared (D2PAK)
• Similar in Size to Industry Standard TO−220 Package
• NRVBB Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
• These are Pb−Free Devices
Mechanical Characteristics:
• Case: Epoxy, Molded, Epoxy Meets UL 94 V−0
• Weight: 1.7 Grams (Approximately) − D2PAK,
1.9 Grams (Approximately) − TO−220
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
• Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds (D2PAK)
• Device Meets MSL1 Requirements (D2PAK)
• ESD Ratings:
♦ Machine Model = C (> 400 V)
♦ Human Body Model = 3B (> 8000 V)
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
ONSEMICONDUC |
05+ |
原厂原装 |
4253 |
只做全新原装真实现货供应 |
|||
ON |
23+ |
TO-263 |
11846 |
一级代理商现货批发,原装正品,假一罚十 |
|||
JINGDAO/晶导微 |
23+ |
ABS |
69820 |
终端可以免费供样,支持BOM配单! |
|||
ON |
08+ |
TO-263 |
5000 |
普通 |
|||
ON |
25+ |
D2PAK3 |
3200 |
全新原装、诚信经营、公司现货销售! |
|||
ON/安森美 |
20+ |
TO-263 |
32500 |
现货很近!原厂很远!只做原装 |
|||
ON |
TO-263 |
22+ |
10000 |
终端免费提供样品 可开13%增值税发票 |
|||
ON |
24+ |
35200 |
一级代理/放心采购 |
||||
ON(安森美) |
25+ |
封装 |
500000 |
源自原厂成本,高价回收工厂呆滞 |
|||
ON/安森美 |
2022+ |
5000 |
只做原装,价格优惠,长期供货。 |
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