Features

• Fine Lithography Trench−based Schottky Technology for Very Low

Forward Voltage and Low Leakage

• Fast Switching with Exceptional Temperature Stability

• Low Power Loss and Lower Operating Temperature

• Higher Efficiency for Achieving Regulatory Compliance

• Low Thermal Resistance

• High Surge Capability

• NRV Prefix for Automotive and Other Applications Requiring

Unique Site and Control Change Requirements; AEC−Q101

Qualified and PPAP Capable

• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant

Mechanical Characteristics:

• Case: Molded Epoxy

• Epoxy Meets UL 94 V−0 @ 0.125 in

• Weight: 11.7 mg (Approximately)

• Lead and Mounting Surface Temperature for Soldering Purposes:

260°C Maximum for 10 Seconds

• MSL 1

Typical Applications

• Switching Power Supplies including Compact Adapters and Flat

Panel Display

• High Frequency and DC−DC Converters

• Freewheeling and OR−ing diodes

• Reverse Battery Protection

• Instrumentation