PIN Sili con Pho todiode

Description The OP955 devices consists of a PIN silicon photodiode molded in a clear epoxy package which allows spectral response from visible to infrared wavelengths. The wide receiving angle provides relatively even reception over a large area. The side-looking package is designed for easy PC b

包装：盒 描述：SENSOR PHOTODIODE 935NM SIDE 传感器，变送器 光学传感器 - 光电二极管

Photodiode

PIN Silicon Photodiode

文件：1.27796 Mbytes Page：5 Pages

SUBMINIATURE PC BOARD RELAY

FEATURES • Subminiature size for high density packaging • DIL pitch terminals • Epoxy sealed for automatic wave soldering • High sensitivity: 150 mW nominal with 84 mW pickup • Meets FCC Part 68.302 1500 V lightning surge • Meets FCC Part 68.304 1000 V dielectric • UL file E43203; CSA file

SUBMINIATURE PC BOARD RELAY

FEATURES • Subminiature size for high density packaging • DIL pitch terminals • Epoxy sealed for automatic wave soldering • High sensitivity: 150 mW nominal with 84 mW pickup • Meets FCC Part 68.302 1500 V lightning surge • Meets FCC Part 68.304 1000 V dielectric • UL / CUR file E43203

SUBMINIATURE PC BOARD RELAY

[Zettler] FEATURES • Subminiature size for high density packaging • DIL pitch terminals • Epoxy sealed for automatic wave soldering • High sensitivity: 150 mW nominal with 84 mW pickup • Meets FCC Part 68.302 1500 V lightning surge • Meets FCC Part 68.304 1000 V dielectric • UL file E43203

CONN PLUG USB3.0 MICRO USB B SLD

文件：152.96 Kbytes Page：1 Pages

CONN PLUG USB3.0 MICRO USB B SLD

文件：152.96 Kbytes Page：1 Pages