POWER MOSFETS IN HERMETIC ISOLATED

[Omnirel] DESCRIPTION This series of hermetically packaged products feature the latest advanced MOSFET and packaging technology. They are ideally suited for Military requirements where small size, high performance and high reliability are required, and in applications such as switching power s

Channel style heat sink with folded back fins

Channel style heat sink with folded back fins for increased cooling surface area. Available with tin plated solderable tabs for easy attachment to the printed circuit card.

KPCS CDMA 3.5V/28.5dBm Linear Power Amplifier Module

PRODUCT DESCRIPTION The AWT6109 is a 3.5 V (3.0 V to 4.2 V) high efficiency, 3 stage amplifier module for Korean Band PCS handsets. The device is manufactured on an advanced InGaP HBT MMIC technology offering state-of-the-art reliability, temperature stability, and ruggedness. Full output power i

THE BREADBOARDING MEDIUM FOR SURFACE MOUNT

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44 Pin SOIC Clip Test Clip

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How to Use This Catalog

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