1 General description

The device is an SD 3.0-compliant bidirectional dual voltage level translator with auto-direction control. It is designed to interface between a memory or SIM card operating between 1.62 V to 3.6 V signal levels and a host with a supply voltage of 1.08 V to 1.98 V. The device supports SD 3.0 SDR104, SDR50, DDR50, SDR25, SDR12 and SD 2.0 High-Speed (50 MHz) and Default-Speed (25 MHz) modes. The device has an auto-enable/ disable function connected to the VCCB supply pin, built-in EMI filters and robust ESD protections (IEC 61000-4-2, level 4) on VCCB or any of the card side pins. External ESD diodes are not required. This device also supports SIM card voltage level translator using CLK and two of the data lines for SD and SIM

card combo sockets.

2 Features and benefits

• Supports up to 208 MHz clock rate

• SD 3.0 specification-compliant voltage translation to support SDR104, SDR50, DDR50, SDR25, SDR12,

High-Speed and Default-Speed modes

• Compliant with ISO-7816 SIM/Smart Card interface requirements

• Support SD/SIM card supply voltages with range of 1.62 V to 3.6 V

• Host microcontroller operating voltage range: 1.08 V to 1.98 V

• Feedback channel for clock synchronization

• Low power consumption by push-pull output stage with break-before-make architecture

• Automatic enable and disable through VCCB

• Integrated pull-up and pull-down resistors

• Integrated EMI filters suppress higher harmonics of digital I/Os

• Integrated 8 kV ESD protection according to IEC 61000-4-2, level 4 on on VCCB or any of the card side pins

• Level shifting buffers keep ESD stress away from the host (zero-clamping concept)

• Available in XQFN16 with 0.4 mm pitch and WLCSP16 with 0.35 mm pitch

3 Applications

• Smart phones

• Mobile handsets

• Digital cameras

• Tablet PCs

• Laptop computers

• SD, MMC or microSD card readers