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NTA53321G0FTTZ中文资料

厂家型号

NTA53321G0FTTZ

文件大小

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页面数量

133

功能描述

NTAG 5 boost - NFC Forum-compliant I2C bridge for tiny devices

数据手册

下载地址一下载地址二到原厂下载

生产厂商

NXP Semiconductors

简称

nxp恩智浦

中文名称

恩智浦半导体公司官网

NTA53321G0FTTZ数据手册规格书PDF详情

General description

NTAG 5 boost uses active load modulation (ALM) to deliver robust and reliable

communication with NFC phones, bringing a new level of convenience to tiny devices.

NXP’s NTAG 5 boost shrinks the NFC footprint while adding AES security, so designers

can deliver ultra-compact devices for use in IoT, consumer, and industrial applications.

It offers an NFC Forum-compliant (customer development board is NFC Forum certified

- Certification ID: 58625) contactless interface that delivers exceptional read range,

giving tiny devices the ability to interact with the cloud and other NFC-enabled devices,

including smartphones.

ALM allows construction of a compact yet highly reliable antenna, creating a significantly

smaller footprint without compromising the read range. When operating in ALM mode,

the read range is significantly longer than when operating in passive mode.

An energy-efficient design, equipped with a hard power-down mode and a standby

current of typically less than 10 μA, ensures long battery life.

2048 bytes (16384 bits) of user memory can be divided into three areas, and each area

can use a different protection level, varying from no protection to 32-/64-bit password

protection or up to 128-bit AES-protected read/write access with mutual authentication.

Different parties in the value chain can have their own dedicated memory areas for

storing access data.

The NTAG 5 boost comes with pre-programmed proof-of-origin functionality to verify

authenticity. The elliptic curve cryptography (ECC) based originality signature can be

locked or reprogrammed by the customer.

With NTAG 5 boost, the device can connect to the cloud with a single tap. The

connection uses an NFC Forum-compliant data exchange mechanism involving

256 bytes (2048 bits) SRAM to ensure highly interoperable data transfers.

Features and benefits

• Antenna size reduction by a factor of 40, same read range as in passive load

modulation

• Long battery life due to low standby current and hard power-down

• Adjustable security levels up to mutual AES authentication

• Flexible split between three open and/or protected memory areas

• Ensured authenticity of product through value chain

• Interoperable data exchange according to NFC Forum standards

• Interoperable and high performance NFC interface

– ISO/IEC 15693 and NFC Forum Type 5 Tag compliant

– 64-bit Unique IDentifier

• Reliable and robust memory

– 2048 bytes (16384 bits) user EEPROM on top of configuration memory

– 256 bytes (2048 bits) SRAM for frequently changing data and pass-through mode

– 40 years data retention

– Write endurance of 1 000 000 cycles

• Configurable contact interface

– I2C slave standard (100 kHz) and fast (400 kHz) mode

– Transparent I2C master channel (for example, read sensors without an MCU)

– One configurable event detection pin

– Two GPIOs as multiplexed I2C lines

– Two Pulse Width Modulation (PWM) channels as multiplexed GPIOs and/or ED pin

– 1.62 V to 5.5 V supply voltage

• Scalable security for access and data protection

– Disable NFC interface temporarily

– Disable I2C interface temporarily

– NFC PRIVACY mode

– Read-only protection as defined in NFC Forum Type 5 Tag Specification

– Full, read-only, or no memory access based on 32-bit password from both interfaces

– Optional 64-bit password protection from NFC perspective

– 128-bit AES authentication as defined in ISO/IEC 15693

– ECC-based reprogrammable originality signature

• Multiple fast data transfer mode

– Pass-through mode with 256 byte SRAM buffer

– Standardized data transfer mode (PHDC, TNEP)

• Low-power budget application support

– Energy harvesting with configurable output voltage up to 30 mW

– Low-power standby current typically <10 μA

– Hard power down current typically <0.25 μA

• Very robust architecture

– -40 °C to 105 °C for EEPROM read, SRAM and register access

– -40 °C to 85 °C for EEPROM write access

• Extensive product support package

– Feature specific application notes

– Development board including software and source code

– Hands-on training

Applications

• Use cases

– Simple dynamic secure pairing

– Commissioning

– Parameterization

– Diagnosis

– Firmware download

– Low BoM and low-power data acquisition for sensors

– Calibration

– Trimming

– Authenticity check and data protection

– Late in the box configuration

– LED driver configuration

– NFC charging

• Applications

– Lighting

– Smart home

– Hearable and Wearable

– Consumer

– Industrial

– Gaming

– Smart sensor

– Smart metering

更新时间:2025-5-13 15:50:00
供应商 型号 品牌 批号 封装 库存 备注 价格
NXP(恩智浦)
24+
TSSOP16
2669
只做原装,提供一站式配单服务,代工代料。BOM配单
NXP
25+
TSSOP16
2500
原厂原装,价格优势
NXP
23+
TSSOP-16
8000
只做原装现货
NXP
23+
TSSOP-16
7000
NXP
23+
TO-18
12800
原装正品代理商最优惠价格,现货或订货
NXP
24+
con
35960
查现货到京北通宇商城
NXP/恩智浦
2025+
TSSOP-16
57945
NXP(恩智浦)
23+
TSSOP-16
7087
NXP原厂渠道,2小时快速发货,大量现货库存
NXP(恩智浦)
24+
TSSOP16
3238
原装现货,免费供样,技术支持,原厂对接
1573
原装现货

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