位置:MIMX8SL1CVNFZAB > MIMX8SL1CVNFZAB详情

MIMX8SL1CVNFZAB中文资料

厂家型号

MIMX8SL1CVNFZAB

文件大小

2045.99Kbytes

页面数量

112

功能描述

i.MX 8XLite Industrial Applications Processors

数据手册

下载地址一下载地址二到原厂下载

生产厂商

恩XP

MIMX8SL1CVNFZAB数据手册规格书PDF详情

Introduction

This data sheet contains specifications for the i.MX 8XLite

processors. The devices have advanced multicore processing

with V2X acceleration supported by Arm® cores. Memory

interfaces for this device include:

• LPDDR4

• DDR3L

• 2× Quad SPI or 1× Octal SPI (FlexSPI)

• eMMC 5.1, RAW NAND, and SD 3.0

Feature

-I/O

1× PCIe 3.0 (1-lane) with L1 substate support. PCIe 1.0 and 2.0 compliant. PCIe 3.0

capable, contact your NXP representative.

2× USB 2.0 ports

1× 1Gb Ethernet with AVB

1x 1Gb Ethernet with TSN

3× CAN/CAN-FD

6× UARTs:

• 4× UARTs (3× with hardware flow control)

• 1× UART tightly coupled with Cortex-M4F cores

• 1× SCU UART (Note: SCU UART is dedicated to the SCU and not available for

general use)

6× I2C

• 4× I2C: High Speed, DMA support

• 1× I2C: PMIC control (SCU, dedicated)

• 1× I2C: Cortex M4F (dedicated)

4× SAI (SAI0 and SAI1 are transmit/receive; SAI2 and SAI3 are receive only)

1× ASRC (Asynchronous Sample Rate Converter) (note: no I/O signals are directly

connected to this module)

1× SPDIF (Tx and Rx)

1× 6-channel ADC converter

3.3 V/1.8 V GPIO

4× PWM channels

4× LPSPI

-Packaging

Case FCPBGA 15 x 15 mm, 0.56 and 0.8 mm mixed pitch

更新时间:2025-12-17 15:16:00
供应商 型号 品牌 批号 封装 库存 备注 价格
恩XP
25+
原厂封装
10280
原厂授权代理,专注军工、汽车、医疗、工业、新能源!
恩XP
25+
原厂封装
11000
恩XP
25+
原厂封装
10280
恩XP
25+
BGA
3000
原厂原装,价格优势