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MIMX8SL1CVNFZAB数据手册规格书PDF详情
Introduction
This data sheet contains specifications for the i.MX 8XLite
processors. The devices have advanced multicore processing
with V2X acceleration supported by Arm® cores. Memory
interfaces for this device include:
• LPDDR4
• DDR3L
• 2× Quad SPI or 1× Octal SPI (FlexSPI)
• eMMC 5.1, RAW NAND, and SD 3.0
Feature
-I/O
1× PCIe 3.0 (1-lane) with L1 substate support. PCIe 1.0 and 2.0 compliant. PCIe 3.0
capable, contact your NXP representative.
2× USB 2.0 ports
1× 1Gb Ethernet with AVB
1x 1Gb Ethernet with TSN
3× CAN/CAN-FD
6× UARTs:
• 4× UARTs (3× with hardware flow control)
• 1× UART tightly coupled with Cortex-M4F cores
• 1× SCU UART (Note: SCU UART is dedicated to the SCU and not available for
general use)
6× I2C
• 4× I2C: High Speed, DMA support
• 1× I2C: PMIC control (SCU, dedicated)
• 1× I2C: Cortex M4F (dedicated)
4× SAI (SAI0 and SAI1 are transmit/receive; SAI2 and SAI3 are receive only)
1× ASRC (Asynchronous Sample Rate Converter) (note: no I/O signals are directly
connected to this module)
1× SPDIF (Tx and Rx)
1× 6-channel ADC converter
3.3 V/1.8 V GPIO
4× PWM channels
4× LPSPI
-Packaging
Case FCPBGA 15 x 15 mm, 0.56 and 0.8 mm mixed pitch
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
恩XP |
25+ |
原厂封装 |
10280 |
原厂授权代理,专注军工、汽车、医疗、工业、新能源! |
|||
恩XP |
25+ |
原厂封装 |
11000 |
||||
恩XP |
25+ |
原厂封装 |
10280 |
||||
恩XP |
25+ |
BGA |
3000 |
原厂原装,价格优势 |
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