General description

Dual logic level N-channel MOSFET in an LFPAK56D (Dual Power-SO8) package, using

application specific (ASFET) repetitive avalanche silicon technology.

Features and benefits

• High reliability LFPAK56D package, copper-clip, solder die attach and qualified to 175 °C

• Tested to 1 Bn avalanche events

• LFPAK copper clip package technology

• Copper-clip, solder die attach

• High robustness and reliability

Applications

• Brushless DC and Brushed DC motor control

• DC-to-DC converters

• High-performance synchronous rectification