1. General description

NPN low VCEsat DFN2020D-3 (SOT1061D) leadless small Surface-Mounted Device (SMD) plastic

package.

PNP complement: PBSS5350PAS

2. Features and benefits

• DFN2020D-3 (SOT1061D) package

• Low collector-emitter saturation voltage VCEsat

• High collector current capability: IC and ICM

• Higher efficiency leading to less heat generation

• Reduced printed-circuit board requirements

• Leadless small SMD plastic package with solderable side pads

• Exposed heat sink for excellent thermal and electrical conductivity

• Suitable for Automatic Optical Inspection (AOI) of solder joint

3. Applications

• Loadswitch

• Battery-driven devices

• Power management

• Charging circuits

• Power switches (e.g. motors, fans)