1. General description

Automotive qualified N-channel MOSFET using the latest Trench 9 low ohmic superjunction

technology, housed in a copper-clip LFPAK88 package. This product has been fully designed and

qualified to meet beyond AEC-Q101 requirements delivering high performance and reliability.

2. Features and benefits

• Fully automotive qualified to beyond AEC-Q101:

• -55 °C to +175 °C rating suitable for thermally demanding environments

• LFPAK88 package:

• Designed for smaller footprint and improved power density over older wire bond packages

such as D²PAK for today’s space constrained high power automotive applications

• Thin package and copper clip enables LFPAK88 to be highly efficient thermally

• LFPAK copper clip technology enabling improvements over wire bond packages by:

• Increased maximum current capability and excellent current spreading

• Improved RDSon

• Low source inductance

• Low thermal resistance Rth

• LFPAK Gull Wing leads:

• Flexible leads enabling high Board Level Reliability absorbing mechanical and thermal

cycling stress, unlike traditional QFN packages

• Visual (AOI) soldering inspection, no need for expensive x-ray equipment

• Easy solder wetting for good mechanical solder joint

• Unique 40 V Trench 9 superjunction technology:

• Reduced cell pitch and superjunction platform enables lower RDSon in the same footprint

• Improved SOA and avalanche capability compared to standard TrenchMOS

• Tight VGS(th) limits enable easy paralleling of MOSFETs

3. Applications

• 12 V automotive systems

• 48 V DC/DC systems (on 12 V secondary side)

• Higher power motors, lamps and solenoid control

• Reverse polarity protection

• Ultra high performance power switching