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BC846BQC-Q中文资料
BC846BQC-Q数据手册规格书PDF详情
Features and benefits
• High power dissipation capability
• Suitable for Automatic Optical Inspection (AOI) of solder joint
• Smaller footprint compared to conventional leaded SMD packages
• Low package height of 0.5 mm
• Qualified according to AEC-Q101 and recommended for use in automotive applications
更新时间：2025-12-5 14:12:00
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
Nexperia |
2024 |
10000 |
全新、原装 |
||||
Nexperia USA Inc. |
25+ |
3-XDFN 裸露焊盘 |
9350 |
独立分销商 公司只做原装 诚心经营 免费试样正品保证 |
|||
Nexperia |
ROHS/NEW. |
原封ORIGIANL |
30050 |
原装,元器件供应/半导体 |
|||
NEXPERIA |
715 |
||||||
NEXPERIA |
2314 |
con |
92 |
现货常备产品原装可到京北通宇商城查价格 |
|||
Nexperia |
2451+ |
N/A |
12000 |
进口原装现货支持实单 |
|||
NEXPERIA/安世 |
2450+ |
TO-236-3SC-59SOT-23- |
9850 |
只做原厂原装正品现货或订货假一赔十! |
|||
Nexperia(安世) |
24+ |
SOT23(TO236) |
7350 |
现货供应,当天可交货!免费送样,原厂技术支持!!! |
|||
Nexperia(安世) |
25+ |
SOT-23-3 |
500000 |
源自原厂成本,高价回收工厂呆滞 |
|||
24+ |
N/A |
56000 |
一级代理-主营优势-实惠价格-不悔选择 |
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