General description

PNP medium power transistor series encapsulated in an ultra thin DFN2020D-3 (SOT1061D) leadless small Surface-Mounted Device (SMD) plastic package with medium power capability and visible and solderable side pads.

Features and benefits

■ High collector current capability IC and ICM

■ Three current gain selections

■ Reduced Printed-Circuit Board (PCB) area requirements

■ Leadless very small SMD plastic package with medium power capability

■ Exposed heat sink for excellent thermal and electrical conductivity

■ Suitable for Automatic Optical Inspection (AOI) of solder joint

■ AEC-Q101 qualified

Applications

■ Linear voltage regulators

■ High-side switches

■ Battery driven devices

■ Power management

■ MOSFET drivers

■ Amplifiers