位置:UPD70F3017AF1-EA6 > UPD70F3017AF1-EA6详情
UPD70F3017AF1-EA6中文资料
UPD70F3017AF1-EA6数据手册规格书PDF详情
DESCRIPTION
The µPD70F3015B, 70F3015BY, 70F3017A, and 70F3017AY are products with on-chip flash memory. Because the devices can be programmed by the user on-board, they are ideal for the evaluation stages of system development, small-scale production of a variety of products, and rapid development of new products.
The V850/SA1 provides a high-level cost performance ideal for applications ranging from low-power camcorders and other AV equipment to portable telephone equipment such as cellular phones and personal handyphone systems (PHS).
FEATURES
○ Number of instructions: 74
○ Minimum instruction execution time:
58.8 ns (@ 17 MHz operation with main system clock (fXX))
50 ns (@ 20 MHz operation with main system clock (fXX))
30.5 µs (@ 32.768 kHz operation with subsystem clock (fXT))
○ General-purpose registers: 32 bits × 32 registers
○ Instruction set:
Signed multiplication, saturation operations, 32-bit shift instructions, bit manipulation instructions, load/store instructions
○ Memory space:
16 MB linear address space
Memory block division function: 2 MB per block
○ Internal memory
• Flash memory
128 KB (µPD70F3015B, 70F3015BY)
256 KB (µPD70F3017A, 70F3017AY)
• RAM
4 KB (µPD70F3015B, 70F3015BY)
8 KB (µPD70F3017A, 70F3017AY)
○ External bus interface: 16-bit data bus
Address bus: Separate output enabled
○ Interrupts and exceptions
External: 8, internal: 23, exceptions: 1
○ I/O lines Total: 85
○ Timer/counters
16-bit timer: 2 channels
8-bit timer: 4 channels
○ Watch timer: 1 channel
○ Watchdog timer: 1 channel
○ Serial interface (SIO)
Asynchronous serial interface (UART)
Clocked serial interface (CSI)
I2C bus interface (µPD70F3015BY, 70F3017AY)
○ A/D converter: 12 channels
○ DMA controller: 3 channels
○ RTP: 8 bits × 1 channel or 4 bits × 2 channels
○ Power-saving functions: HALT/IDLE/STOP modes
○ Packages: 100-pin plastic LQFP (14 × 14 mm)
121-pin plastic FBGA (12 × 12 mm)
APPLICATIONS
○ Low-power portable devices Cellular phones, PHSs, and camcorders
UPD70F3017AF1-EA6产品属性
- 类型
描述
- 型号
UPD70F3017AF1-EA6
- 制造商
NEC
- 制造商全称
NEC
- 功能描述
32-BIT SINGLE-CHIP MICROCONTROLLER
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
NEC |
24+ |
BGA |
1395 |
||||
NEC |
2004 |
BGA |
1395 |
原装现货海量库存欢迎咨询 |
|||
NEC |
24+ |
BGA |
2140 |
全新原装!现货特价供应 |
|||
NEC |
23+ |
BGA |
4500 |
全新原装、诚信经营、公司现货销售! |
|||
NEC |
24+ |
TQFP |
6868 |
原装现货,可开13%税票 |
|||
NEC |
25+ |
QFPZ |
680 |
原装现货热卖中,提供一站式真芯服务 |
|||
NEC |
2016+ |
QFP |
3000 |
只做原装,假一罚十,公司可开17%增值税发票! |
|||
NEC |
23+ |
TQFP100 |
1026 |
特价库存 |
|||
NEC |
1822+ |
TQFP100 |
9852 |
只做原装正品假一赔十为客户做到零风险!! |
|||
NEC |
23+ |
QFP |
65480 |
UPD70F3017AF1-EA6 资料下载更多...
UPD70F3017AF1-EA6 芯片相关型号
- D71055C
- UPD70216HGF-16-3B9
- UPD70216HLP-12
- UPD70216HLP-20
- UPD703003A
- UPD703003GC-25
- UPD703015AYGC
- UPD703017AYF1
- UPD703031A
- UPD703033A
- UPD703035AY
- UPD703101GJ-33
- UPD70320GJ-5BG
- UPD70325L-8
- UPD705101
- UPD70F3017AYF1-EA6
- UPD70F3035AGF-3BA
- UPD70F3035AY
- UPD70F3035AYGF-3BA
- UPD70F3040Y
- UPD70F3040YGM-UEU
- UPD71055C-8
- UPD72001C-11
- UPD72001C-A8
- UPD7225GC-AB6
- UPD72850A
- UPD72871
- UPD72871F1
- UPD750006
- UPD750064
Datasheet数据表PDF页码索引
- P1
- P2
- P3
- P4
- P5
- P6
- P7
- P8
- P9
- P10
- P11
- P12
- P13
- P14
- P15
- P16
- P17
- P18
- P19
- P20
- P21
- P22
- P23
- P24
- P25
- P26
- P27
- P28
- P29
- P30
- P31
- P32
- P33
- P34
- P35
- P36
- P37
- P38
- P39
- P40
- P41
- P42
- P43
- P44
- P45
- P46
- P47
- P48
- P49
- P50
- P51
- P52
- P53
- P54
- P55
- P56
- P57
- P58
- P59
- P60
- P61
- P62
- P63
- P64
- P65
- P66
- P67
- P68
- P69
- P70
- P71
- P72
- P73
- P74
- P75
- P76
- P77
- P78
- P79
- P80
- P81
- P82
- P83
- P84
- P85
- P86
- P87
- P88
- P89
- P90
- P91
- P92
- P93
- P94
- P95
- P96
- P97
- P98
Renesas Electronics America 日本瑞萨电子株式会社
Renesas Electronics America是日本瑞萨电子株式会社(Renesas Electronics Corporation)在美国的分支机构,专注于提供各种高性能微控制器、模拟和数字集成电路解决方案。瑞萨电子成立于2002年,是全球领先的半导体制造商,致力于满足汽车、工业、消费电子和通信等多领域的需求。 Renesas Electronics America 提供的产品包括微控制器、微处理器、模拟IC、功率管理IC和系统级集成解决方案,广泛应用于各类嵌入式系统和智能设备中。公司以技术创新为核心竞争力,致力于不断推动产品性能和能效的提升,以满足客户在智能化和数字化时代的需求。