DESCRIPTION

The UPA809TF contains two NE688 NPN high frequency silicon bipolar chips. NECs new low profile TF package is ideal for all portable wireless applicatons where reducing component height is a prime consideration. Each transistor chip is independently mounted and easily configured for two stage cascade LNAs and other similar applications.

FEATURES

• SMALL PACKAGE OUTLINE:

SOT-363 package measures just 2 mm x 1.25 mm

• LOW HEIGHT PROFILE:

Just 0.60 mm high

• HIGH COLLECTOR CURRENT:

IC MAX = 100 mA