位置:ABV162660 > ABV162660详情
ABV162660中文资料
ABV162660数据手册规格书PDF详情
FEATURES
• Miniature size (33
´15.9
´10.3 mm) (1.299
´.626
´.406 inch)
• Sealed construction for use in adverse environment
-Sealed construction by epoxy
resin and rubber cap keeps off the cause of miscontact such as dust Conforming
to IP67* of IEC protective construction classification
• Elastomer double molding technology, an industry first and ultrasonic swaging
technology contribute to uniform seling in high production quantities
• UL/CSA/VDE/SEMKO approved
*Based on the protective construction classification of IED, items which satisfy the test
requirements are denoted with an IP designation.
TYPICAL APPLICATIONS
• Automotives
• Agricultural devices
• Industrial equipment
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
PANASONIC |
20+ |
开关元件 |
2896 |
就找我吧!--邀您体验愉快问购元件! |
|||
24+ |
N/A |
56000 |
一级代理-主营优势-实惠价格-不悔选择 |
||||
ABRACON |
23+ |
原厂原包 |
19960 |
只做进口原装 终端工厂免费送样 |
ABV162660 资料下载更多...
ABV162660 芯片相关型号
- 1-284507-1
- 1-284517-1
- 1-284539-8
- 1410140-1
- 1546551-7
- 1N5945B
- 2102352-2
- 2-1394462-8
- 2-284046-2
- 2-796635-0
- 282836-5
- 284539-8
- 4530
- 628-L
- 7-1394461-2
- 885012205051
- ABV162640
- ABV162641
- ABV162650
- ABV162651
- ABV162661
- DTA124EET1G
- HFE26_17
- HFE29_17
- LMS78_6.5-1.5
- MMUN2217LT1G
- MMUN2232LT1G
- MUN2215T1G
- MUN5211T1G
- RWP03160-10_17
NAIS相关芯片制造商
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