封装/外壳：40-VFQFN 裸露焊盘 包装：托盘 描述：BLE/ANT/ 802.15.4/THREAD/ZIGBEE RF/IF，射频/中频和 RFID 射频收发器 IC

Bluetooth 5.3 SoC supporting Bluetooth Low Energy, Bluetooth mesh, Thread and Zigbee, qualified for up to 105°C.

features -Arm processor - 64 MHz Arm® Cortex-M4 with FPU - 256 KB Flash + 32 KB RAM -Bluetooth 5.3 Radio - Direction Finding - Long Range - Bluetooth mesh - +8 dBm TX power - -95 dBm sensitivity (1 Mbps) -IEEE 802.15.4 radio support - Thread - Zigbee -Full range of digital in

封装/外壳：40-VFQFN 裸露焊盘 包装：托盘 描述：BLE/ANT/ 802.15.4/THREAD/ZIGBEE RF/IF，射频/中频和 RFID 射频收发器 IC

Power Profiler Kit II

Key features • Variable power supply voltage ranging from 0.8 V to 5.0 V (software configurable) • Maximum 1 A current measurement • Accurate measurement down to approximately 200 nA • Resolution down to 0.2 μA • 100 kS/s sampling speed • Automatic switching between five current measurement