包装：袋 描述：BOX FIBERGLASS GRY 13.74\ 盒子，外壳，机架 箱

包装：散装 描述：BOX FIBERGLASS GRY 13.74\ 盒子，外壳，机架 箱

HEXFET Power MOSFET

Description The IRF6613 combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of an SO-8 and only 0.7 mm profile. The DirectFET package is compatible with existing layout ge

Advanced Synchronous Rectified Buck MOSFET Drivers with Protection Features

VR11.1, 4-Phase PWM Controller with Light Load Efficiency Enhancement and Load Current Monitoring Features The ISL6334B, ISL6334C control microprocessor core voltage regulation by driving up to 4 interleaved synchronous-rectified buck channels in parallel. This multiphase architecture resul

Ultrahigh-Speed Switching Applications

General-Purpose Switching Device Applications Features • The MCH6613 incorporates two elements in the same package which are N-channel and P-channel low ON resistance and high-speed switching MOSFETs, thereby enabling high-density mounting. • Excellent ON-resistance characteristic. • 1.5V driv

Low-Voltage Analog Temperature Sensor in an SC70 Package

文件：114.42 Kbytes Page：6 Pages

Low-Voltage Analog Temperature Sensor in an SC70 Package

文件：114.42 Kbytes Page：6 Pages