MURATA's package technology expertise has enabled the

development of the Chip CERALOCK. High-density mounting can

be realized because of the small package and the elimination of

the need for an external load capacitor.

Features

1. Oscillation circuits do not require external load capacitors.

2. Available in a wide frequency range.

3. Extremely small and have a low profile.

4. No adjustment is necessary for oscillation circuits.