• Compatible with MLCC footprint

• Ultra-high stability of capacitance value:

o Temperature 70ppm/K (-55 °C to +150 °C)

o Voltage <-0.02/Volt

o Negligible capacitance loss through

ageing

• Low profile 0.1mm or 0.25mm

• Small size 0.80 x 0.80 mm (0303 format)

• Break down voltage : 100V

• Low leakage current

• High reliability

• High operating temperature (up to 150 °C)

• Compatible with high temperature cycling

during manufacturing operations (exceeding

300 °C)

• Compatible with EIA 00303 footprint

• Applicable for standard wire bonding assembly (ball and wedge)