• High stability

o Temperature ±0,5 (-55°C to +150°C)

o Voltage <0.1/Volts

o Negligible capacitance loss through

ageing

• Small size 0402 (1.2mm x 0.7mm +/-40µm)

• Low leakage current <100pA

• High reliability

• Low ESL caracteristics

• Applicable for embedded and wire

bonding

• Low Profile ( 100µm)