DESCRIPTION

The HPR7XXC Series provides high power densities where space is critical. The small SIP package measures only 2.2 x .3 x .4 (56 x 9 x 10 mm). Designed for high density boards, the package is non-conductive, which presents advantages over painted metal enclosures.

FEATURES

● ROHS COMPLIANT

● EFFICIENCY >80

● SIP PACKAGE

● HIGH POWER DENSITY: >16 WATTS/INCH3

● LOW COST

● SINGLE AND DUAL OUTPUTS

● INTERNAL INPUT AND OUTPUT FILTERING

● SIX-SIDED SHIELDING