位置：MC01W08051330K > MC01W08051330K详情
MC01W08051330K中文资料
MC01W08051330K数据手册规格书PDF详情
Features
• Small size and light weight
• Suitable for both wave and reflow soldering
• Reduction of assembly costs
更新时间：2025-12-10 15:34:00
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
MULTICOMP |
ROHS |
56520 |
一级代理 原装正品假一罚十价格优势长期供货 |
||||
MULTICOMP |
2022+ |
5000 |
全新原装 货期两周 |
||||
MULTICOMP |
490 |
优势货源原装正品 |
|||||
MULTICO |
23+ |
N/A |
8560 |
受权代理!全新原装现货特价热卖! |
MC01W08051330K 资料下载更多...
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MULTICOMP相关芯片制造商
Datasheet数据表PDF页码索引
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