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MC00625W0402164R9中文资料
MC00625W0402164R9数据手册规格书PDF详情
Features
• Small size and light weight
• Suitable for both wave and reflow soldering
• Reduction of assembly costs
更新时间：2025-11-1 9:50:00
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
MULTICOMP |
2022+ |
10000 |
全新原装 货期两周 |
||||
MULTICOMP |
23+ |
SMD0402 |
13000 |
原厂授权一级代理,专业海外优势订货,价格优势、品种 |
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MULTICOMP相关芯片制造商
Datasheet数据表PDF页码索引
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