位置：MC00625W0402154R9 > MC00625W0402154R9详情
MC00625W0402154R9中文资料
MC00625W0402154R9数据手册规格书PDF详情
Features
• Small size and light weight
• Suitable for both wave and reflow soldering
• Reduction of assembly costs
更新时间：2025-11-4 9:00:00
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
MULTICOMP |
25+ |
原装 |
10000 |
全新原装现货库存 |
|||
MULTICOMP |
NA |
8560 |
一级代理 原装正品假一罚十价格优势长期供货 |
||||
MULTICOMP |
2022+ |
10000 |
全新原装 货期两周 |
||||
MULTI |
23+ |
NA |
786 |
专做原装正品,假一罚百! |
MC00625W0402154R9 资料下载更多...
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MULTICOMP相关芯片制造商
Datasheet数据表PDF页码索引
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