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13637中文资料
13637数据手册规格书PDF详情
Applications
The heat shrink tubing is manufactured with modified radiation cross-linked polyolefin. The specially designed halogen free formulation makes the tubing very flexible and shrink at lower temperature. Suitable for applications where temperature sensitive components protection, e.g. PVC jacketed wire and cable and quick shrinkage is required. It has good mechanical and electrical performances.
更新时间:2026-7-23 18:42:00
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
24+/25+ |
200 |
原装正品现货库存价优 |
|||||
TE |
NA |
50903 |
一级代理 原装正品假一罚十价格优势长期供货 |
13637 资料下载更多...
13637 芯片相关型号
- ADN-S-20-25-A-P
- ALCT-544-V
- ALCT-544-VSLASHQ
- M2SES-2BD-M
- M2SES-2BD-M2
- M2SES-2BD-M2SLASHCE
- M2SES-2BD-M2SLASHN
- M2SES-2BD-M2SLASHQ
- M2SES-2BD-M2SLASHUL
- M2SES-2BD-MSLASHCE
- M2SES-2BD-MSLASHN
- M2SES-2BD-MSLASHQ
- M2SES-2BD-MSLASHUL
- M2SES-2BD-P
- M2SES-2BD-PSLASHCE
- M2SES-2BD-PSLASHN
- M2SES-2BD-PSLASHQ
- M2SES-2BD-PSLASHUL
- M2SES-2BD-R
- PIC24HJ256GP308ISLASHPF
- PIC24HJ256GP308ISLASHPF-ES
- PIC24HJ256GP308ISLASHPT
- PIC24HJ256GP308ISLASHPT-ES
- PTN15-E10SC20-H
- W5RS-5B1-R2SLASHQ
- XL3MB815ST15IW-XCE
- XL3MB815ST15IW-XCL
- XL3MB815ST15IW-XV9
- XL3MB815ST15IW-XX1
- XL3MB815ST15IW-XX2
MULTICOMP相关芯片制造商
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