Features:

• For surface mounted applications in order to optimise board space

• Low profile package

• Built-in strain relief

• Glass passivated junction

• Excellent clamping capability

• Low inductance

• Repetition Rate (duty cycle) : 0.05% (1.5SMCJ) 0.01% (SMBJ)

• Fast Response Time : Typically less than 1 ps from 0 volts to BV min.

• Typical Id less than 1μA above 10V

• High Temperature Soldering : 250°C / 10 seconds (1.5SMCJ) 260°C / 10 seconds (SMBJ)