Features:

• Glass passivated chip junction in moulded plastic package

• 1,500 W surge capability at 1 ms

• Low zener impedance

• Excellent clamping capability

• Fast response time : Typically less than 1 ps from 0 volts to BV minimum

• Typical IR less than 1 µA above 10 V

• High temperature soldering : 260°C / 10 seconds /.375 inches, (9.5 mm) lead length / 5 lbs. (2.3 kg) tension

• Low clamping voltages

• Wide voltage range

• High transient power dissipation

• No wear-out limitation

• Small physical size