High Volume Sensor for

Low Pressure Applications

Freescale Semiconductor has developed a low cost, high volume, miniature pressure sensor package which is ideal as a sub--module component or a disposable unit. The unique concept of the Chip Pak allows great flexibility in system design while allowing an economic solution for the designer. This new chip carrier package uses Freescale Semiconductor’s unique sensor die with its piezoresistive technology, along with the added feature of on--chip, thin--film temperature compensation and calibration.

Features:

• Low Cost

• Integrated Temperature Compensation and Calibration

• Ratiometric to Supply Voltage

• Polysulfone Case Material (Medical, Class V Approved)

• Provided in Easy--to--Use Tape and Reel

Application Examples

• Respiratory Diagnostics

• Air Movement Control

• Controllers

• Pressure Switching