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74LS75N中文资料
74LS75N数据手册规格书PDF详情
4-BIT D LATCH
The TTL/MSI SN54/74LS75 and SN54/74LS77 are latches used as temporary storage for binary information between processing units and input/output or indicator units. Information present at a data (D) input is transferred to the Q output when the Enable is HIGH and the Q output will follow the data input as long as the Enable remains HIGH. When the Enable goes LOW, the information (that was present at the data input at the time the transition oc curred) is retained at the Q output until the Enable is permitted to go HIGH.
The SN54/74LS75 features complementary Q and Q output from a 4-bit latch and is available in the 16-pin packages. For higher component density applications the SN54/74LS77 4-bit latch is available in the 14-pin package with Q outputs omitted.
74LS75N产品属性
- 类型
描述
- 型号
74LS75N
- 制造商
Motorola
- 功能描述
74LS75N
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
TI/TEXAS |
23+ |
DIP |
8931 |
||||
24+ |
5000 |
公司存货 |
|||||
TI |
23+ |
DIP |
5000 |
原装正品,假一罚十 |
|||
TI |
24+ |
DIP |
2987 |
只售原装自家现货!诚信经营!欢迎来电! |
|||
TI |
24+ |
DIP |
6430 |
原装现货/欢迎来电咨询 |
|||
TI |
21+ |
DIP-16 |
10000 |
原装,品质保证,请来电咨询 |
|||
TI |
2021+ |
DIP-16 |
7600 |
原装现货,欢迎询价 |
|||
TI |
24+ |
DIP-16 |
30000 |
原装正品公司现货,假一赔十! |
|||
TI |
24+ |
DIP-16 |
6000 |
全新原装深圳仓库现货有单必成 |
|||
TI |
2022+ |
DIP-16 |
7600 |
原厂原装,假一罚十 |
74LS75N 资料下载更多...
74LS75N 芯片相关型号
- 74LS74AP
- 74LS86P
- 74LS90D
- 79C10
- 79C15
- 9533
- AC0805JPX7R8BB
- AC0805JPX7R8BN
- AC0805JPX7R9BB
- AC0805JPX7R9BN
- ADC32RF5X
- FQP44N10
- FQP45N15V2
- FQP46N15
- FQP4N25
- OP747ARU
- OP747ARU-REEL
- OP747ARUZ
- OP747ARUZ-REEL
- OP747ARZ
- OP747ARZ-REEL
- OP747ARZ-REEL7
- UN2E6-150LSMD
- UN2E6-230LSMD
- UN2E6-SMD
- UN2H8-4000L
- UN2H8-4000LL
- UN2H8-4500L
- UN2H8-4500LL
Datasheet数据表PDF页码索引
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Motorola, Inc 加尔文制造公司
摩托罗拉(Motorola)是全球集成通讯方案和嵌入电子方案的领导者,该分部目前共有人员约32,000人,分布在制造厂、实验室、技术设计中心及全球销售机构。摩托罗拉Motorola公司的半导体分部设在美国的克萨斯州的Austin。是世界头号嵌入处理器制造商,所生产的嵌入芯片无处不在,从蜂窝电话、桌面电脑、Internet收发器件、打印机、多媒体产品、数码相机到运输核工业应用如安全气囊、卫星全球定位系统,都可以发现嵌入芯片的踪影。它的集成通讯方案包括:软件增强无线电话、two-wayradio、messaging和卫星通讯产品及系统,也包括网络产品和Internet接入产品。