Features

• Designed for applications with stringent profile restrictions

• Passivated mesa structure for very low leakage currents

• Epitaxial structure minimizes forward voltage drop

• Hermetically sealed, extremely low profile ceramic seal package with flexible copper leads for surface mount soldering or welding

• Very low package inductance and thermal resistance

• Qualification estimated completion August 1998, includes temperature cycling 2,000 cycles at -197°C to +150°C (liquid-to-liquid)

• Available in reverse voltage ranges from 50V to 300V