DESCRIPTION

The MPV series of surface mount Varactor diodes utilizes a unique new monolithic fabrication technology. This technology employs package / device integration accomplished at the wafer fabrication level. Since the cathode and anode interconnections utilize precision photolithographic techniques rather than wire bonds, parasitic package inductance is minimized and tightly controlled.

KEY FEATURES

Tape and Reeled for Automatic Assembly

Low Series Inductance (<0.2nH typical)Low Parasitic Capacitance (0.06 pf typical)

Meets All Commercial Qualification Requirements

0204 Outline

RoHS Compliant

APPLICATIONS/BENEFITS

Low voltage VCOs

Wide bandwidth VCOs

VCXO’s

Linear VCOs

Low noise VCOs

Tunable Filter

Tiny surface mount footprintUltra tight parametric distribution