位置:M1AFS600 > M1AFS600详情

M1AFS600中文资料

厂家型号

M1AFS600

文件大小

1893.33Kbytes

页面数量

27

功能描述

Terrestrial FPGA and SoC Product Catalog

Fusion Family of Mixed Signal FPGAs

数据手册

原厂下载下载地址一下载地址二到原厂下载

生产厂商

Microsemi Corporation

简称

Microsemi美高森美

中文名称

美高森美公司官网

LOGO

M1AFS600数据手册规格书PDF详情

Features and Benefits

High Capacity

• 15 k to 1 M System Gates

• Up to 144 kbits of True Dual-Port SRAM

• Up to 300 User I/Os

Reprogrammable Flash Technology

• 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS Process

• Instant On Level 0 Support

• Single-Chip Solution

• Retains Programmed Design when Powered Off

High Performance

• 350 MHz System Performance

• 3.3 V, 66 MHz 64-Bit PCI†

In-System Programming (ISP) and Security

• ISP Using On-Chip 128-Bit Advanced Encryption Standard (AES) Decryption (except ARM®-enabled ProASIC®3 devices) via JTAG (IEEE 1532–compliant)†

• FlashLock® to Secure FPGA Contents

Low Power

• Core Voltage for Low Power

• Support for 1.5 V-Only Systems

• Low-Impedance Flash Switches

High-Performance Routing Hierarchy

• Segmented, Hierarchical Routing and Clock Structure

Advanced I/O

• 700 Mbps DDR, LVDS-Capable I/Os (A3P250 and above)

• 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation

• Wide Range Power Supply Voltage Support per JESD8-B, Allowing I/Os to Operate from 2.7 V to 3.6 V

• Bank-Selectable I/O Voltages—up to 4 Banks per Chip

• Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V / 2.5 V / 1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X† and LVCMOS 2.5 V / 5.0 V Input

• Differential I/O Standards: LVPECL, LVDS, B-LVDS, and M-LVDS (A3P250 and above)

• I/O Registers on Input, Output, and Enable Paths

• Hot-Swappable and Cold Sparing I/Os‡

• Programmable Output Slew Rate† and Drive Strength

• Weak Pull-Up/-Down

• IEEE 1149.1 (JTAG) Boundary Scan Test

• Pin-Compatible Packages across the ProASIC3 Family

Clock Conditioning Circuit (CCC) and PLL†

• Six CCC Blocks, One with an Integrated PLL

• Configurable Phase-Shift, Multiply/Divide, Delay Capabilities and External Feedback

• Wide Input Frequency Range (1.5 MHz to 350 MHz)

Embedded Memory†

• 1 kbit of FlashROM User Nonvolatile Memory

• SRAMs and FIFOs with Variable-Aspect-Ratio 4,608-Bit RAM Blocks (×1, ×2, ×4, ×9, and ×18 organizations)†

• True Dual-Port SRAM (except ×18)

ARM Processor Support in ProASIC3 FPGAs

• M1 ProASIC3 Devices—ARM®Cortex™-M1 Soft Processor Available with or without Debug

M1AFS600产品属性

  • 类型

    描述

  • 型号

    M1AFS600

  • 制造商

    MICROSEMI

  • 制造商全称

    Microsemi Corporation

  • 功能描述

    Fusion Family of Mixed Signal FPGAs

更新时间:2025-5-8 14:20:00
供应商 型号 品牌 批号 封装 库存 备注 价格
Microsemi(美高森美)
24+
FPBGA-484
949
深耕行业12年,可提供技术支持。
MICROSEMI
20+
BGA-484
1001
就找我吧!--邀您体验愉快问购元件!
Microsemi(美高森美)
2021+
FPBGA-484(23x23)
499
Microsemi Corporation
22+
208PQFP
9000
原厂渠道,现货配单
MicrosemiCorporation
24+
256-FPBGA(17x17)
66800
原厂授权一级代理,专注汽车、医疗、工业、新能源!
Microsemi Corporation
21+
208-BFQFP
24
100%进口原装!长期供应!绝对优势价格(诚信经营)
Microsemi Corporation
24+
484-FPBGA(23x23)
65200
一级代理/放心采购
Microsemi(美高森美)
2447
FPBGA-484(23x23)
31500
60个/托盘一级代理专营品牌!原装正品,优势现货,长
Microchip Technology
环保ROHS+
484-BGA
14785
热卖FPGA原装正品
MICROCHIP
25+
Plastic Ball Grid Array
20000
原厂微芯渠道.全新原装!

Microsemi相关电路图

  • MICROSS
  • MICRO-TRANSFORMER
  • MICROTUNE
  • MILBANK
  • MILESTONE
  • MILL-MAX
  • MILWAUKEE
  • MIMIX
  • MINEBEAMITSUMI
  • MINGTEK
  • MINI
  • MINILOGIC

Microsemi Corporation 美高森美公司

中文资料: 96017条

Microsemi Corporation是一家全球领先的半导体和系统解决方案供应商,专注于高性能、低功耗的产品。公司成立于1983年,总部位于美国加利福尼亚州的阿尔塔迪纳(Aliso Viejo, CA)。Microsemi的产品广泛应用于航空航天及国防、通信、数据中心、工业及医疗等多个领域。 Microsemi提供的产品包括:模拟和混合信号集成电路、FPGA(现场可编程门阵列)、电源管理解决方案、时钟和时序解决方案、嵌入式系统以及与通信相关的设备。公司以其创新的技术和高可靠性著称,致力于支持客户在其复杂和多变的应用中实现高效能和高安全性。 通过不断的研发投资和战略收购,Microsemi不