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KV2123中文资料

厂家型号

KV2123

文件大小

290.19Kbytes

页面数量

4

功能描述

ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES

数据手册

下载地址一下载地址二到原厂下载

生产厂商

MICROSEMI

KV2123数据手册规格书PDF详情

DESCRIPTION

Our EPSM packaged devices are designed for the most demanding commercial and Military requirements where the inconsistent performance inherent in plastic surface mount packages cannot be tolerated. These package styles extend the surface mount construction format to 6 GHz for high performance wireless applications. Select varactors from three families of C/V curves for designs through 6 GHz. They are available in multiple chip configuration as well as outlines which directly replace SOT23 and SOD323 devices. Other devices and values are always available. Contact our applications engineering department for more details.

KEY FEATURES

▪ Wide Range of Capacitance Values

▪ For Frequencies from VHF to 6 GHz

▪ Lower Parasitics

▪ Superior Consistency/Repeatability

▪ Footprints Available for SOT23/ SOD323/SOD123

▪ Dozens of Configurations Available

▪ Mil Grade Ceramic/Epoxy Amalgam

▪ Tape & Reel Available for Pick and Place Assembly

▪ RoHS Compliant1

APPLICATIONS/BENEFITS

▪ High Performance Wireless Surface Mount Options for GSM, TAGS, WANS, PCS

▪ Wideband VCO applications

▪ Voltage Tuned Filters

▪ VCXOs

KV2123产品属性

  • 类型

    描述

  • 型号

    KV2123

  • 制造商

    MICROSEMI

  • 制造商全称

    Microsemi Corporation

  • 功能描述

    ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES