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JANHCF1N5804中文资料
JANHCF1N5804数据手册规格书PDF详情
FEATURES:
• Chip Outline Dimensions: 41 x 41 mils
• Chip Thickness: 8 to 12 mils
• Anode Metallization: Aluminum
• Metallization Thickness: 50,000Ã Nominal
• Bonding Area: 23 x 23 mils Min.
• Back Metallization: Gold
• Junction Passivated with Thermal Silicon Dioxide - Planar Design
• Backside Available with Solderable Ag Backside as JANHCF or JANKCF
JANHCF1N5804产品属性
- 类型
描述
- 型号
JANHCF1N5804
- 制造商
MICROSEMI
- 制造商全称
Microsemi Corporation
- 功能描述
2.5 AMPS FAST RECOVERY RECTIFIER CHIP 50 - 150 VOLTS
更新时间：2025-10-29 16:06:00
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
CCZL |
新 |
17 |
全新原装 货期两周 |
||||
MSC |
22+ |
CDIP |
12245 |
现货,原厂原装假一罚十! |
|||
JANIN746AIAW |
25+ |
12 |
12 |
||||
IR |
22+ |
6000 |
终端可免费供样,支持BOM配单 |
||||
IR |
23+ |
8000 |
只做原装现货 |
||||
IR |
23+ |
7000 |
|||||
Microchip Technology |
25+ |
UB |
9350 |
独立分销商 公司只做原装 诚心经营 免费试样正品保证 |
|||
MICROCHIP(美国微芯) |
24+ |
DO35 |
7350 |
现货供应,当天可交货!免费送样,原厂技术支持!!! |
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