Description

In Microsemis Powermite® surface mount package, these zener diodes provide power-handling capabilities found in larger packages. In addition to its size advantages, Powermite® package features include a full metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an integral heat sink. Its innovative design makes this device ideal for use with automatic insertion equipment.

Features

• Surface Mount Packaging

• Integral Heat Sink Locking Tabs

• Compatible with automatic insertion equipment

• Full metallic bottom eliminates flux entrapment

• Zener voltage 1.8 to 100V

• Low noise

• Low reverse leakage current

• Tight tolerance available