Features

• All devices are 100% surge tested.

• Low capacitance of 100 pF or less

• 3σ (sigma) lot norm screening performed on standby current (ID) for all M prefix devices

• Molding compound flammability rating: UL94V-O

• Unidirectional versions available only

• Two different terminations available in C-bend (modified J-bend with DO-214AB) or Gullwing (DO-215AB)

• Moisture classification is Level 1 with no dry pack required per IPC/JEDEC J-STD-020B for all M prefix devices

• Suppress transients up to 1,500W at 10/1000 μs (see Figure 4-1)

• Enhanced reliability screening options with M prefix are available in reference to MILPR

19500. Refer to High Reliability Non-Hermetic Products Portfolio for more details on

the screening options.

(See Part Nomenclature for all available options.)

• RoHS compliant versions available

• Axial-lead equivalent packages for thru-hole mounting are available as MLCE6.5 to

MLCE170Ae3 with 1500W rating (contact Microchip for other surface mount options.)

Applications/Benefits

• Available in working stand-off voltage range of 6.5 to 170V

• Low capacitance for high frequency data line protection to 1 MHz

• Protection for aircraft fast data rate lines up to level 5 waveform 4 and level 2 waveform 5A in RTCA/DO-160G

(also see MicroNote 130) and ARINC 429 with bit rates of 100 kb/s (per ARINC 429, Part 1, par 2.4.1.1)

• IEC61000-4-2 ESD 15 kV (air), 8 kV (contact)

• IEC61000-4-5 (lightning) as further detailed in LCE6.5 thru LCE170A data sheet

• T1/E1 line cards

• Base stations, WAN and XDSL interfaces

• CSU/DSU equipment