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DSPIC30F3010中文资料

厂家型号

DSPIC30F3010

文件大小

3105.58Kbytes

页面数量

203

功能描述

High-Performance, 16-Bit Digital Signal Controllers

数字信号处理器和控制器 - DSP, DSC 44LD 20MIPS 24 KB

数据手册

下载地址一下载地址二到原厂下载

生产厂商

Microchip Technology

简称

Microchip微芯科技

中文名称

微芯科技股份有限公司官网

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DSPIC30F3010数据手册规格书PDF详情

Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended to be a complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the “dsPIC30F Family Reference Manual”(DS70046). For more information on the device instruction set and programming, refer to the “dsPIC30F/33F Programmers Reference Manual” (DS70157).

High-Performance Modified RISC CPU:

• Modified Harvard architecture

• C compiler optimized instruction set architecture with flexible Addressing modes

• 83 base instructions

• 24-bit wide instructions, 16-bit wide data path

• 144 Kbytes on-chip Flash program space (Instruction words)

• 8 Kbytes of on-chip data RAM

• 4 Kbytes of nonvolatile data EEPROM

• Up to 30 MIPS operation:

- DC to 40 MHz external clock input

- 4 MHz-10 MHz oscillator input with PLL active (4x, 8x, 16x)

- 7.37 MHz internal RC with PLL active(4x, 8x, 16x)

• 44 interrupt sources:

- 5 external interrupt sources

- 8 user selectable priority levels for each interrupt source

- 4 processor trap sources

• 16 x 16-bit working register array

DSP Engine Features:

• Dual data fetch

• Accumulator write-back for DSP operations

• Modulo and Bit-Reversed Addressing modes

• Two, 40-bit wide accumulators with optional saturation logic

• 17-bit x 17-bit single-cycle hardware fractional/integer multiplier

• All DSP instructions single cycle

• ±16-bit single-cycle shift

Peripheral Features:

• High-current sink/source I/O pins: 25 mA/25 mA

•Timer module with programmable prescaler:

- Five 16-bit timers/counters; optionally pair 16-bit timers into 32-bit timer modules

• 16-bit Capture input functions

• 16-bit Compare/PWM output functions

•3-wire SPI modules (supports 4 Frame modes)

•I2CTM module supports Multi-Master/Slave mode and 7-bit/10-bit addressing

• 2 UART modules with FIFO Buffers

• 2 CAN modules, 2.0B compliant (dsPIC306010A)

• 1 CAN module, 2.0B compliant (dsPIC306015)

Motor Control PWM Module Features:

• 8 PWM output channels:

- Complementary or Independent Output modes

- Edge and Center-Aligned modes

• 4 duty cycle generators

• Dedicated time base

• Programmable output polarity

• Dead-Time control for Complementary mode

• Manual output control

• Trigger for A/D conversions

Quadrature Encoder Interface Module Features:

• Phase A, Phase B and Index Pulse input

• 16-bit up/down position counter

• Count direction status

• Position Measurement (x2 and x4) mode

• Programmable digital noise filters on inputs

• Alternate 16-bit Timer/Counter mode

• Interrupt on position counter rollover/underflow

DSPIC30F3010产品属性

  • 类型

    描述

  • 型号

    DSPIC30F3010

  • 功能描述

    数字信号处理器和控制器 - DSP, DSC 44LD 20MIPS 24 KB

  • RoHS

  • 制造商

    Microchip Technology

  • 核心

    dsPIC

  • 数据总线宽度

    16 bit

  • 程序存储器大小

    16 KB 数据 RAM

  • 大小

    2 KB

  • 最大时钟频率

    40 MHz

  • 可编程输入/输出端数量

    35

  • 定时器数量

    3

  • 设备每秒兆指令数

    50 MIPs

  • 工作电源电压

    3.3 V

  • 最大工作温度

    + 85 C

  • 封装/箱体

    TQFP-44

  • 安装风格

    SMD/SMT

更新时间:2025-5-1 23:00:00
供应商 型号 品牌 批号 封装 库存 备注 价格
Microchip(微芯)
24+
标准封装
58048
原厂渠道供应,大量现货,原型号开票。
Microchip Technology
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25000
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MICROCHIP
23+
DIP
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Microchip
23+
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30000
全新原装正品
MICROCHIP
15+
QFN44
1500
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MICROCHIP
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20000
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285
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Microchip
23+
SOP-28
6000
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MICROCHIP
2024+
N/A
70000
柒号只做原装 现货价秒杀全网

DSPIC30F3010-30I/SP 价格

参考价格:¥24.8630

型号:DSPIC30F3010-30I/SP 品牌:Microchip 备注:这里有DSPIC30F3010多少钱,2025年最近7天走势,今日出价,今日竞价,DSPIC30F3010批发/采购报价,DSPIC30F3010行情走势销售排排榜,DSPIC30F3010报价。

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Microchip Technology 微芯科技股份有限公司

中文资料: 151928条

微芯科技股份有限公司(英语:MicrochipTechnologyInc.,英文简写:Microchip),是一个美国微控制器、内存与类比半导体制造商。它的产品包含微控制器(PIC微控制器、dsPIC/PIC24、PIC32)、序列式EEPROM、序列式SRAM、KEELOQ组件、无线电频率(RF)组件、热组件、功率与电池管理类比组件,也有线性、接口与混合信号组件。还有一些接口组件包含USB、ZigBee/MiWi,CANbus与Ethernet。公司总部位于亚利桑那州钱德勒,晶圆厂则分别位于亚利桑那州坦佩及奥勒冈州格雷斯罕。主要的竞争者有亚德诺半导体、爱特梅尔、飞思卡尔(分拆自摩托罗拉)、英