FEATURES

◇ For surface mounted applications in order to optimize board space.

◇ Low profile package.

◇ Built-in strain relief.

◇ Glass passivated junction.

◇ Low inductance.

◇ Excellent clamping capability.

◇ Repetition Rate (duty cycle): 0.01.

◇ Fast response time: typically less than 1.0ps from 0 volt to BV for Unidirectional types.

◇ Typical IR less than 1μA above 10V.

◇ High Temperature soldering: 260°C/10 seconds at terminals.

◇ Plastic package has Underwriters Laboratory Flammability 94V-O.