FEATURES

✧ For surface mounted applications in order to optimize board space.

✧ Low profile package.

✧ Built-in strain relief.

✧ Glass passivated junction.

✧ Low inductance.

✧ Excellent clamping capability.

✧ Repetition Rate (duty cycle): 0.01.

✧ Fast response time: typically less than 1.0ps from 0 volt to VBR for 8nidirectional types.

✧ Typical IR less than 1μA above 10V.

✧ High Temperature soldering: 260°C/10 seconds at terminals.

✧ Plastic package has Underwriters Laboratory Flammability 94V-O.

MECHANICAL DATA

✧ Case: JEDEC DO-201 Molded Plastic.

✧ Terminals: Axial leads, solderable per MIL-STD-750, Method 2026.

✧ Polarity: Color and dG enotes cathode except Bipolar.

✧ Standard Packaging: 12mm tape (EIA STD RS-481).

✧ Weight: 0.002 ounce, 0.061 grams.