FEATURES

• For surface mounted applications in order to optimize board space

• Low profile package

• Built-in strain relief

• Glass passivated junction

• Low inductance

• Excellent clamping capability

• Repetition rate (duty cycle):0.01

• Fast response time: typically less than 1.0 ps from 0 volts to BV for unidirectional types

• Typical IR less than 1µA above 10V

• High temperature soldering: 250°C/10 seconds at terminals

• Plastic package has Underwriters Laboratory Flammability Classification 94 V-O