位置:DS34T101 > DS34T101详情

DS34T101中文资料

厂家型号

DS34T101

文件大小

803.77Kbytes

页面数量

74

功能描述

Single/Dual/Quad/Octal TDM-Over-Packet Chip

Single/Dual/Quad/Octal TDM-over-Packet Chip

数据手册

原厂下载下载地址一下载地址二到原厂下载

生产厂商

MAXIM

DS34T101数据手册规格书PDF详情

General Description

These IETF PWE3 SAToP/CESoPSN/TDMoIP/HDLC compliant devices allow up to eight E1, T1 or serial streams or one high-speed E3, T3, STS-1 or serial stream to be transported transparently over IP, MPLS or Ethernet networks. Jitter and wander of recovered clocks conform to G.823/G.824, G.8261, and TDM specifications. TDM data is transported in up to 64 individually configurable bundles. All standards based TDM-over-packet mapping methods are supported except AAL2. Frame-based serial HDLC data flows are also supported. With built-in full featured E1/T1 framers and LIUs. These ICs encapsulate the TDM-over-packet solution from analog E1/T1 signal to Ethernet MII while preserving options to make use of TDM streams at key intermediate points. The high level of integration available with the DS34T10x devices minimizes cost, board space, and time to market.

Features

♦ Full-Featured IC Includes E1/T1 LIUs and Framers, TDMoP Engine, and 10/100 MAC

♦ Transport of E1, T1, E3, T3 or STS-1 TDM or CBR Serial Signals Over Packet Networks

♦ Full Support for These Mapping Methods: SAToP, CESoPSN, TDMoIP (AAL1), HDLC, Unstructured, Structured, Structured with CAS

♦ Adaptive Clock Recovery, Common Clock, External Clock and Loopback Timing Modes

♦ On-Chip TDM Clock Recovery Machines, One Per Port, Independently Configurable

♦ Clock Recovery Algorithm Handles Network PDV, Packet Loss, Constant Delay Changes, Frequency Changes and Other Impairments

♦ 64 Independent Bundles/Connections

♦ Multiprotocol Encapsulation Supports IPv4, IPv6, UDP, RTP, L2TPv3, MPLS, Metro Ethernet

♦ VLAN Support According to 802.1p and 802.1Q

♦ 10/100 Ethernet MAC Supports MII/RMII/SSMII

♦ Selectable 32-Bit, 16-Bit or SPI Processor Bus

♦ Operates from Only Two Clock Signals, One for Clock Recovery and One for Packet Processing

♦ Glueless SDRAM Buffer Management

♦ Low-Power 1.8V Core, 3.3V I/O

Applications

  TDM Circuit Extension Over PSN

     o Leased-Line Services Over PSN

     o TDM Over GPON/EPON

     o TDM Over Cable

     o TDM Over Wireless

  Cellular Backhaul Over PSN

  Multiservice Over Unified PSN

  HDLC-Based Traffic Transport Over PSN

 

DS34T101产品属性

  • 类型

    描述

  • 型号

    DS34T101

  • 制造商

    MAXIM

  • 制造商全称

    Maxim Integrated Products

  • 功能描述

    Single/Dual/Quad/Octal TDM-over-Packet Chip

更新时间:2025-11-27 8:22:00
供应商 型号 品牌 批号 封装 库存 备注 价格
MAXIM
25+
BGA484
18600
百分百原装正品 真实公司现货库存 本公司只做原装 可
MAXIM
BGA484
630
正品原装--自家现货-实单可谈
MAXIM
13+
TEBGA
3738
原装分销
MAXIM
2016+
BGA484
1980
只做原装,假一罚十,公司可开17%增值税发票!
MAXIM
24+
BGA484
5000
全现原装公司现货
MAXIM
23+
TEBGA
8888
专做原装正品,假一罚百!
MAXIM
25+23+
BGA484
22558
绝对原装正品全新进口深圳现货
MAXIM
25+
BGA-484
1001
就找我吧!--邀您体验愉快问购元件!
MAXIM
20+
BGA484
11520
特价全新原装公司现货
Maxim
22+
484TEBGA
9000
原厂渠道,现货配单