Description

The MA4P7452F-1072T is a surface mountable PIN diode in a Non-Magnetic ( patent pending ) Metal Electrode Leadless Faced (MELF) package. The device incorporates M/A-COM’s proven HIPAX technology to produce a low inductance ceramic package with no ribbons or whisker wires. The package utilizes M/A-COM’s new nonmagnetic plating process to provide an extremely low permeability, hermetically sealed package. Incorporated in the package is a passivated PIN diode that is full face bonded on both the cathode and anode of the chip to maximize surface area for lower electrical and thermal resistance. The MA4P7452F-1072T has been comprehensively characterized both electrically and mechanically to ensure repeatable and predictable performance.

Features

■ Non-Magnetic Package Suitable for MRI Applications

■ Rectangular MELF SMQ Ceramic Package

■ Hermetically Sealed

■ Lower Rs for Lower Series Loss

■ Longer tL for Lower Intermodulation Distortion

■ Lower Cj for Higher Series Isolation

■ Higher Average Incident Power Handling Capability