Description

The MA4P1250 and MA4P1450 are square surface mountable PIN diodes in a non-rollable, metal electrode leadless faced (MELF) package. They incorporate passivated PIN diode chips that are full face bonded to refractory metal pins. These parts utilize M/A-COM’s HIPAX technology in a low inductance ceramic package with no ribbons or whisker wires. The package is hermetically sealed at temperatures exceeding 300˚C.

Features

● Non-Rollable MELF Design

● Hermetically Sealed

● Low Loss, Low Distortion

● Passivated PIN Diode Chips

● Full Face Chip Bonds

● Non-Magnetic Package

● Pick and Place Compatibility