Fine Pitch SMT Stacking Connectors (Parallel Board-to-Board)

Tyco Electronics 0.8mm FH surface-mount connectors are designed for parallel board stacking applications using subminiature connectors to meet today’s electronic industry requirements for high density packaging.

It is possible to save more than 50 of the required board space when compared to conventional 1.27 [.050] centerline connectors.

Product Facts

■ For parallel board stacking applications

■ High density packaging on 0.8 [.031] centerline spacing

■ Available sizes from 40 to 200 positions (in 20 position increments)

■ Board stacking heights available from 5 [.197] to 16 [.630] (in 1 [.039] increments)

■ Bellows type spring contacts are resistant to scooping and stubbing during mating and unmating

■ Positioning bosses for proper on-board orientation

■ Available packaged on“tape-and-reel” for automatic placement per EIA standards

■ Recognized under the Component Program of Underwriter Laboratories Inc., File No. E28476