Description

A PIN diode series-shunt switch element with a unique integrated thermal terminal for dissipating heat in the series diode created by the DC and RF input power. The thermal terminal allows for optimum heat dissipation by providing a direct thermal connection between the series diode and the circuit heatsink while also being electrically isolated. The chip is designed to provide a heat transfer conduit that does not interfere with the PIN diode anode (input) and cathode (output) electrical terminals, especially with respect to RF performance. The chip is fabricated using M/A-COM Technology Solutions patented HMIC™ process and features silicon pedestals embedded in a low loss, low dispersion glass for low leakage current. The topside is fully encapsulated with silicon nitride and has an additional polymer layer to protect against damage during handling and assembly.

Features

• Specified Bandwidth: 45MHz—2.5GHz

• Useable 30MHz to 3.0GHz

• Low Loss <0.5dB

• High isolation >40dB

• High C.W. Incident Power, 50W at 500MHz

• High Input IP3, +66dBm @ 500MHz

• Unique Thermal Terminal for Series Diode

• Surface Mount Device (No Wire Bonds)

• Rugged Silicon-Glass Construction

• Silicon Nitride Passivation Protective Polymer

• Protective Polymer Scratch Protection

• RoHS Compliant