Description

The MA4P7452F-1072T is a surface mountable PIN diode in a non-magnetic, Metal Electrode Leadless Faced (MELF) package. The device incorporates M/A-COM Technology Solutions time proven HIPAX technology to produce a low inductance ceramic package with no ribbons or whisker wires. Incorporated in the package is a hard glass passivated, CERMACHIP™ PIN chip that is full face bonded on both the cathode and anode to maximize surface area for the lowest electrical and thermal resistance. The package utilizes a non-magnetic plating process that provides for a package with extremely low permeability. The MA4P7452F-1072T has been comprehensively characterized both electrically and mechanically to ensure repeatable and predictable performance. The non-magnetic MA4P7452F-1072T is the electrical equivalent of its magnetic counterpart the MA4P7002F-1072T.

Features

♦ Non-Magnetic Package Suitable for MRI

Applications

♦ Rectangular MELF SMQ Ceramic Package

♦ Hermetically Sealed

♦ Low Rs for Low Series Loss

♦ Long τL for Lower Intermodulation Distortion

♦ Low Cj for High Series Isolation

♦ High Average Incident Power Handling

♦ RoHS Compliant