T-1 PACKAGE SOLID STATE LAMP

文件：32.409 Kbytes Page：2 Pages

T-1 (3mm) PACKAGE SOLID STATE LAMP

Description The MVL-354BG, a blue source color device, is made with InGaN ( on SiC substrate) LED die. The package is T-1 ( 3mm) water clear plastic type. Features • High performance - 2.5mW (490nm) • Superior SiC substrate technology • Excellent chip to chip consistency • High reliability

T-1 PACKAGE SOLID STATE LAMP

Description The MVL-354B, a blue source color device, is made with InGaN ( on SiC substrate) LED die. The package is T-1( 3mm) water clear plastic type. Features • High performance - 3.5mW (450nm) • Superior SiC substrate technology • Excellent chip to chip consistency • High reliability A

T-1 PACKAGE SOLID STATE LAMP

Description The MVL-354BV, a blue source color device, is made with GaN ( on SiC substrate) LED die. The package is T-1( 3mm) water clear plastic type. Features • High performance - 1.15mW (430nm) • Superior SiC substrate technology • Excellent chip to chip consistency • High reliability A

ACD354x Single Channel 14-bit 250MSPS and 500MSPS Analog-to-Digital Converter (ADC)

1 Features • 14-bit, single channel 250 and 500MSPS ADC • Noise spectral density: -158.5dBFS/Hz • Thermal Noise: 74.5dBFS • Single core (non-interleaved) ADC architecture • Power consumption: – 435mW (500MSPS) – 369mW (250MSPS) • Aperture jitter: 75fs • Buffered analog inputs – Programma

FUSE HOLDER SELECTION GUIDE

文件：258.149 Kbytes Page：4 Pages

THRU-HOLE THREADED INSERT W/FLANGE

文件：121.32 Kbytes Page：1 Pages

Fuse Blocks and Clips - For 3AG Fuses

文件：100.29 Kbytes Page：1 Pages

REMOCON MODULE

文件：303.32 Kbytes Page：8 Pages